Adesto and Cadence collaborate on xSPI ecosystem for IoT

2019-12-04 | Author : FanyPCB

Adesto Technologies and Cadence Design(PCB Layout) Systems have announced a cooperation to expand the ecosystem around the extended Serial Peripheral Interface (xSPI) communication protocol, enabling higher transfer rates and lower flash latency in IoT devices .
The Cadence memory model for xSPI enables use of the octal NOR flash with the host processor in an xSPI system, including support for Adesto’s EcoXiP octal xSPI non-volatile memory (NVM).adesto
Code-intensive wireless stacks and artificial intelligence processing necessitate high transfer rates and low latency for flash memory devices in IoT systems.
Expanding the traditional four I/Os (quad SPI) to eight I/Os (octal SPI) with the xSPI serial synchronous protocol increases the serial NOR flash throughput.
David Pe?a, verification IP product management director, system & verification group at Cadence said “The availability of the memory model for Adesto’s EcoXiP and host controller design IP for xSPI devices enables joint customers to quickly and easily adopt xSPI while developing their products.”
Adesto says its EcoXiP NVM eliminates the need for expensive on-chip embedded flash in a broad range of emerging IoT applications.
“Moving intelligence to the edge can provide significant advantages, but heavier local processing means that architects must revisit their system’s memory architecture,” says Gideon Intrater, Adesto’s CTO.
“xSPI makes it easier for system designers to reap the benefits of octal devices like EcoXiP is committed to smarter, more efficient, and more humane design. ”
The Cadence memory model of xSPI is part of the Cadence verification suite, which is optimized for Xcelium parallel logic simulation and supported third-party simulators

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