Introduction to PCB Panelization

PCB panelization is a critical manufacturing process that arranges multiple circuit boards into a single panel for efficient production. At FanyPCB, we've optimized panel designs for thousands of projects, helping clients achieve 20-35% cost reductions while improving manufacturing yields. This guide covers essential panelization techniques and design considerations.

Why Panelization Matters in PCB Manufacturing

Grouping multiple PCBs into standardized panels (typically 18"×24" or 21"×24") provides significant advantages:

Manufacturing Efficiency

• Enables simultaneous processing of multiple boards

• Reduces handling time during assembly

• Optimizes machine utilization rates

Quality Improvement

• Minimizes board warping during processing

• Ensures consistent solder paste application

• Facilitates automated optical inspection

Cost Reduction

• Lowers per-unit fabrication costs

• Reduces material waste through optimal nesting

• Decreases assembly setup time

PCB Panel Design Guidelines

Designing an effective PCB panel requires careful consideration of multiple factors to ensure manufacturability, assembly efficiency, and cost-effectiveness. The process begins with determining the optimal panel size based on your manufacturer's standard dimensions, typically ranging from 18"×24" to 21"×24" for most fabrication facilities. These standard sizes help minimize material waste and maximize equipment compatibility throughout the production process.

The spacing between individual boards on the panel represents a critical design parameter that affects both manufacturing yield and depaneling quality. For V-scored panels, maintaining at least 2mm spacing between boards ensures clean separation while preventing damage to adjacent circuits. Tab-routed designs generally require slightly larger spacing of 3-5mm to accommodate the routing tools and breakaway tabs. The panel borders should provide sufficient clearance, typically 5-10mm, for handling during fabrication and assembly processes.

Tooling and fiducial marker placement forms another essential aspect of panel design. A minimum of three tooling holes, preferably 3.2mm in diameter, should be positioned in the panel rails to ensure precise alignment during manufacturing and assembly. Fiducial markers, typically 1mm diameter copper circles with soldermask clearance, need strategic placement near panel corners and individual boards for accurate component placement during SMT assembly.

Copper balancing across the panel plays a significant role in preventing warpage during thermal processing. Designers should distribute copper layers as evenly as possible, avoiding large blank areas that could lead to uneven thermal expansion. This becomes particularly important for multilayer boards where asymmetric copper distribution can cause significant warping during lamination and reflow processes.

For assembly optimization, designers should consider component placement orientation relative to the panel layout. Aligning similar components in the same direction across all boards in the panel can significantly improve pick-and-place machine efficiency. Including test coupons and process control patterns in the panel rails provides valuable quality control data without consuming valuable board space.

The depaneling method should be clearly specified and designed into the panel from the beginning. V-scoring requires straight edges and works best for thicker boards, while tab routing offers more flexibility for complex board outlines. Breakaway tabs should be designed with stress concentration features like mouse bites or perforations to facilitate clean separation without damaging the boards.

Finally, clear labeling and identification markings should be incorporated into the panel design. This includes board identifiers, orientation markers, and any special handling instructions. These markings help prevent assembly errors and ensure proper handling throughout the manufacturing process. By considering all these factors during the panel design phase, manufacturers can achieve optimal production efficiency while maintaining high quality standards.

FanyPCB's Panelization

We specialize in optimizing PCB panel designs to maximize manufacturing efficiency and reduce costs. Our engineers analyze your board requirements to recommend the best panelization approach—whether V-scoring, tab routing, or mixed-technology arrays—ensuring high material utilization (90%+). 

We design panels with assembly in mind, incorporating precise fiducial markers, tooling holes, and component orientation for smooth SMT processing. For prototypes or high-volume production, we deliver cost-effective solutions with clear depaneling instructions.

Our expertise includes:

Advanced nesting algorithms for optimal material use

Mixed-technology panels (rigid, flex, and rigid-flex)

Assembly-friendly layouts to streamline SMT processes

Custom depaneling solutions (laser scoring, precision routing)