Gold Finger PCB Technology

Gold fingers are precision-engineered contact points plated with hard gold along PCB edges, designed for high-reliability connections in applications requiring frequent mating cycles. FanyPCB design and produce gold finger PCBs that meet the most demanding industry standards for durability and electrical performance.

Gold Finger Design Tips and Guide

Plating Composition and Thickness

Our gold finger plating process begins with a nickel barrier layer (150-200μ") to prevent copper migration, followed by cobalt-hardened gold plating ranging from 3μ" to 50μ" thickness. The nickel underlayer provides essential diffusion barrier properties while the hard gold surface ensures optimal conductivity and wear resistance.

Beveling Process Requirements

Precision edge beveling forms a critical part of gold finger manufacturing. We maintain strict 30° or 45° chamfer angles with ±1° tolerance to ensure smooth connector engagement. Our CNC-controlled beveling equipment produces clean, burr-free edges that meet MIL-STD-275 specifications for insertion reliability.

Critical Design Rules

• Maintain 0.5mm minimum clearance from board edges

• Eliminate solder mask and silkscreen over contact surfaces

• Position copper layers at least 1mm from contact edges

• Include appropriate lead-in chamfers for connector alignment

Gold Finger PCB Applications

High-Cycle Industrial Applications

Our gold fingers withstand 10,000+ insertion cycles in industrial control systems, test equipment, and military applications. The hardened gold surface resists wear from repeated mating while maintaining stable contact resistance.

High-Speed Digital Systems

Gold fingers provide reliable edge connections for:

• DDR memory modules

• PCIe expansion cards

• High-speed backplane systems

• Server and datacenter hardware

FanyPCB's Gold Finger Manufacturing Capabilities

We have developed specialized manufacturing processes to produce gold finger PCBs that exceed industry durability and performance standards. Our production begins with precision surface preparation, where we carefully clean and micro-etch the contact edges to ensure optimal plating adhesion. This critical first step prevents common failure modes like plating delamination or uneven deposition.

For specialized applications, we offer custom plating solutions including selective gold plating and hybrid surface finishes. This flexibility allows us to accommodate unique design requirements while maintaining the reliability expected from gold finger connections. Our technical team works closely with clients to develop application-specific manufacturing protocols when standard processes require modification.

All gold finger PCBs undergo final electrical testing to verify contact resistance and current-carrying capacity. We document plating thickness measurements and provide certification with each shipment, giving customers complete traceability of their boards' manufacturing history. This comprehensive approach to quality control has established FanyPCB as a trusted supplier for mission-critical applications where connector reliability is paramount.