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Hybrid Stack-Up PCB
Hybrid Stack-Up PCB
Hybrid Stack-Up PCB

Hybrid Stack-Up PCB

A Hybrid Stack-Up PCB combines both rigid and flexible materials within a single printed circuit board (PCB) design, providing a versatile solution for complex electronic systems. The hybrid stack-up structure allows for the integration of flexible circui

Materials: FR-4
Surface Finish: ENIG
Applications: wearable devices, automotive electronics, medical equipment, and communication devices.

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What is a Hybrid Stack-Up PCB?

A Hybrid Stack-Up PCB integrates rigid and flexible circuit materials in a single board, enabling compact, durable designs for advanced electronics like wearables and automotive systems.


Key Features:

  • Combination of Rigid and Flexible Layers: Integrates rigid PCBs and flexible circuits within a single design, offering more versatile form factors.

  • Compact and Lightweight Design: Reduces overall size and weight while maintaining performance.

  • Enhanced Durability: Combines the strength of rigid materials with the flexibility of flexible substrates, ensuring long-term reliability.

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