4-Layer Gold Finger PCB for IoT Servers

This 4-layer hybrid rigid-flex PCB combines the best of rigid and flexible circuit technologies, enabling breakthrough designs for modern consumer electronics. Perfect for applications where space constraints, reliability, and innovative form factors are

4-layer rigid-flex PCB combines the durability of FR4 rigid boards with the flexibility of polyimide circuits, enabling revolutionary designs for modern consumer electronics.

This 4-layer rigid-flex PCB combines the strength of FR4 rigid boards with the flexibility of polyimide circuits, enabling innovative designs for next-generation consumer electronics.

This 4-layer gold finger PCB is engineered for next-gen IoT servers, combining impedance-controlled routing, gold-plated edge connectors, and optimized power delivery for 24/7 operation in demanding data environments.