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 4-Layer Impedance Gold Finger PCB
 4-Layer Impedance Gold Finger PCB

4-Layer Impedance Gold Finger PCB

This 4-layer gold finger PCB is engineered for high-speed SSD applications, combining impedance-controlled traces and gold-plated edge connectors to ensure reliable data transfer and robust performance in consumer electronics.

Base Material: FR4
Layers: 4
Process Technology: Impedance Board, Gold Finger Board
Surface Treatment: Gold Plating
Application: Consumer Electronics

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Product Features & Benefits:

✔ Gold Finger Edge Connectors – 30μ" gold plating ensures 500+ insertion cycles for durable SSD connections

✔ Impedance Control – Matched trace impedance (50Ω ±7%) for stable high-speed signals (PCIe/NVMe)

✔ High-Density Routing – 6/4mil outer layer and 5/4mil inner layer traces for compact SSD designs

✔ Optimized for SSDs – Supports 5Gbps+ data transfer with minimal signal loss

✔ Robust Construction – 1.0mm FR4 thickness for mechanical stability

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