Network Communication Equipment PCBA

Our communication equipment PCBA solutions are engineered for next-gen networks, featuring:

High-frequency substrates (Rogers/Isola FR408HR) for 5G/mmWave

16+ layer HDI boards with blind/buried vias

±3% impedance control for 100Ω differential pairs

EMI-optimized layouts (EN 55032 compliant)

End-to-End PCBA Manufacturing and Assembly

Advanced capabilities for telecom OEMs:

✔ 5G Infrastructure PCBA:

• AAU/RRU control boards

• Massive MIMO antenna arrays

• Beamforming power management

✔ Data Center Solutions:

• 400G/800G optical module assembly

• Switch fabric PCBAs (TOR/EOR)

• PoE++ power delivery systems

✔ Testing & Validation:

• TDR testing for impedance verification

• Bit error rate testing <10⁻¹²

• Thermal cycling (-40°C to +125°C)
  

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