dual-thickness copper PCB

Manufacturing Process: The key technical aspects of the manufacturing process are as follows: material cutting, dry film lamination, graphic transfer for the second and fifth layers, graphic etching, dry film stripping, graphic inspection, dry film lamination, graphic transfer for the third and fourth layers, graphic etching, dry film stripping, graphic inspection, browning, stacking, lamination, mechanical drilling, electrical testing, dry film lamination, graphic transfer for the first and sixth layers, graphic electroplating, graphic etching, graphic inspection, green solder mask application, silkscreen printing, shaping, electrical testing, surface treatment, final inspection, and packaging.

This process overcomes the deficiencies of existing technologies and provides a method for producing dual-thickness copper PCBs with different thickness copper foil layers in the lamination process.

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