Introduction to PCB X-Ray Inspection

X-ray inspection has become an essential quality control process in modern PCB manufacturing, enabling engineers to detect hidden defects that visual inspection cannot identify. At FanyPCB, we utilize advanced 3D Automated X-ray Inspection (AXI) technology to examine solder joints, vias, and component connections non-destructively. This critical testing method ensures the reliability of complex assemblies, particularly for high-density designs with BGAs, QFNs, and fine-pitch components.

How 3D AXI Technology Works

Our X-ray inspection systems employ high-resolution computed tomography to generate three-dimensional images of PCB assemblies. The process begins with the X-ray tube emitting controlled radiation that penetrates the board structure. As the radiation passes through different materials, detectors capture variations in absorption, creating detailed cross-sectional images. Advanced software then reconstructs these images into 3D volumetric models, allowing our technicians to inspect solder joint quality, measure void percentages, and verify internal layer alignment with micron-level precision.

Benefits of X-Ray Inspection

Implementing PCB X-ray inspection provides manufacturers with several critical advantages. The technology reveals internal defects like solder voids, cracks, and bridging that optical inspection methods might miss. For high-reliability applications, it enables precise measurement of solder fillet dimensions and void content per IPC-7095 standards. The non-destructive nature preserves sample integrity while providing comprehensive data for process optimization and failure analysis. Most importantly, it significantly reduces field failures by catching latent defects before products reach the market.

Applications in PCB Manufacturing

X-ray inspection plays a crucial role throughout the PCB manufacturing process at FanyPCB. During new product introduction, it helps validate assembly processes and spot potential design-for-manufacturability issues before committing to full production runs. The technology proves particularly valuable for inspecting BGA and QFN packages, where it reveals solder joint integrity hidden beneath components - something visual inspection simply can't achieve. Our systems precisely measure void percentages to ensure they stay within acceptable limits, typically maintaining less than 25% for most standard applications. For complex multilayer boards, X-ray verification confirms proper layer-to-layer registration while detecting any internal shorts or opens that might compromise functionality. When quality issues arise, whether in production or from field returns, X-ray analysis provides non-destructive failure investigation, delivering clear root cause analysis without damaging valuable samples. This comprehensive inspection capability gives manufacturers confidence in their products at every stage, from prototyping through volume production.

FanyPCB's X-Ray Inspection Capabilities

Our inspection lab features state-of-the-art 3D AXI systems with sub-micron resolution, capable of examining features as small as 0.5µm. We maintain strict protocols aligned with IPC Class 3 standards for high-reliability electronics. Each inspection includes comprehensive reporting with:

• High-resolution images of detected anomalies

• Quantitative void percentage measurements

• Layer-to-layer alignment data

• Comparative analysis against design specifications