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High Speed 16-Layer HDI RF PCB Design

High Speed 16-Layer HDI RF PCB Design

Xilinx V6 DDR4 Signal Conversion PCB Board Design

Layers: 16 layers
Pin Number: 7,945
PCB Design Software: Allegro, Altium, Pads
Design Delivery Time: 14 days
Design Challenges: RF signal integrity + high-speed digital
FPGA: Xilinx Virtex-6
DSP: TI TMS320C6455
Memory: DDR4
Mixed-Signal: ADC + VSC8641 SERDES
Power: Linear regulators
Max Signal Rate: 3.125 Gb/s
Max Current: 20A

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Unlock next-level performance with our High Speed 16-Layer HDI RF PCB Design, built to support complex high-frequency and high-speed applications. This advanced multilayer PCB integrates Xilinx V6 FPGA, TI DSP, and DDR4 memory, achieving data rates up to 3.125Gb/s through precise RF/digital co-design and controlled impedance routing. Optimized using Allegro PCB Designer, it delivers up to 20A power while ensuring signal integrity and low noise.


At Fany PCB Design, we specialize in 16-layer HDI PCB design, RF PCB design, and multilayer PCB layout for demanding systems such as communication backplanes, radar systems, and embedded control boards. Our engineers follow industry best practices for how to design a PCB circuit board, including simulation, stack-up planning, differential pair routing, and thermal/power management.


Whether you need a custom 16-layer high-speed backplane design or a fully integrated RF system board, Fany delivers tailored PCB design solutions with fast turnaround and high reliability.

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